Technical Workshop

April 19, 2018

“Virtual Prototyping, Design, Validation and Manufacturing of High-End Products”

07:45-13:00 Registration
14:30-16:15 First Session, Chairs:

Prof. Dan PITICĂ, Ph.D., Technical University of Cluj Napoca, Romania

Cosmin MOISĂ, Continental Automotive, Timişoara

14:30-15:00 “ANSYS Solution for simulation of Chip/Package/System scenarios for SI/PI and EMI/EMC applications”

Markus LAUDIEN, Lead Application Engineer – ANSYS Germany GmbH

15:00-15:05 Q&A
15:05-15:35 “What Every Scope User Needs to Know About Transmission Lines”

Francesco RAIMONDI, Teledyne LeCroy via ARC Brasov

15:35-15:40 Q&A
15:40-16:10 “Design Space Exploration for Signal Integrity” Nicolae BĂDULESCU, Application Engineer, TENSOR – ANSYS Channel Partner
16:10-16:15 Q&A
16:15-16:45 Coffee & Networking Break
16:45-18:30 Second Session, Chairs:

Prof. Norocel CODREANU, Ph.D., Politehnica University of Bucharest

Bogdan POPESCU, MICROCHIP Technology, Bucureşti

16:45-17:25 “Simulation for Innovation – Connecting the Dots”

Ralf KAKEROW, Advanced Architecture and Systems – TE Connectivity Germany GmbH

17:25-17:30 Q&A
17:30-17:50 “Pushing the limits of copper interconnects: How far can we go?”

Cătălin NEGREA, Ph.D., Continental Automotive Romania

17:50-17:55 Q&A
17:55-18:25 “IPC Designer Certification Programs”

Augustin STAN, Master IPC Trainer – L&G Advice Serv SRL, Bucharest

18:25-18:30 Q&A



Agenda HR Workshop April 20, – TIE 2018

Strategic Partnership for Education

Senate Room @ UPIT, Pitesti


08:45 -09:00   Registration

09:00-09:30    Strategic Partnership for Education – Workshop opening

                        Dumitru CHIRLESAN, Rector, University of Pitesti

                        Paul SVASTA, Profesor at Electronics, Telecommunications and Information Technology Faculty, Bucharest; President of APTE Bucharest

                        Alexander KLEIN, General Manager, Miele Brasov

Aurelia FLOREA, Human Resources Manager, HR Workshop Coordinator                    

 9:30-10:00     Brief summary regarding the activities of the Strategic Partnership for Education group 

                        Aurelia FLOREA, Human resource Manager Miele

10:00-12:00    First session:  The relationship between the Academic environment and the Industrial environment– Definite actions

                        Session chair:  Dan PITICĂ, Vice-rector Technical University of Cluj-Napoca 

                        Session co-chair: Cosmin MOISA, Head of Product Development Center – Continental Automotive Romania srl 

                        Cristian NEGRESCU, Dean of Electronics, Telecommunications and Information Technology Faculty Bucharest The importance of the academia-industry partnership– Best Practices actions that contribute to competence development

                      Anton HADAR – ALMA MATER President- Alma Mater’s support in promoting the strategic partnership between the academic environment and the industrial environment

Gabriel VLADUT, President of ARIES Oltenia –  STEM and CS4all-Romanians – ,,How the STEM method can be applied to the existing educational system?

                        Eugen COCA – Department Director at University of Suceava – A way to improve students’ training in physics

12:00-12:15    Q&A

12.30-13.30    Lunch break Academica

13:40-15:00    Second session: Educational environment – Best practices

Session chair:  Paul SVASTA, Profesor at Electronics, Telecommunications and Information Technology Faculty, Bucharest; President of APTE Bucharest

Session co-chair:  Alin MAZARE, University of Pitesti

Doru URSUTIU, University Transilvania of Brasov – Fondul Stiintescu in Schools

Camelia VADUVA, Department Chief Staffing and Career Management Renault Romania

15:00-15:10    Q&A

15:10-16:00    How the government can contribute to adapting the educational system to electronic industry demands

                        Roxana MANZATU, Deputy PSD Brasov

                        Aurelia FLOREA, Human resource Manager Miele – Pilot project launched in Brasov

16:00-16:10    Q&A

16:10-16:30    Summary and future action plan, Closing