Programme Workshop TIE 2014

Posted by admin On March 20, 2014 Comments Off on Programme Workshop TIE 2014

WORKSHOP

 „ADVANCE TOPICS IN ELECTRONICS DESIGN AND ASSEMBLING TECHNOLOGY”

April 10, 2014

 

13.00–16.30  Registration
14.15-14.30  Welcome universities:
Prof. Marius Oteşteanu,Ph.D., Vice-rector for Scientific Research and External Relations, “Politehnica” University of Timişoara, Romania
Welcome industries: 
Prof. Dr. h. c. Christian von Albrichsfeld, Ph.D., Continental, Romania 
Welcome TIE technical workshop:
Prof. Dr. h. c.  Paul Svasta, Ph.D.  Politehnica University of Bucharest, Romania
14.30-16.30 First Session: Electronic Module Value ChainSession chairs:
Prof. Dan Pitică, Ph.D., Technical University of Cluj Napoca, Romania
Detlef Bonfert, Ph.D., Fraunhofer EMFT, Munich, Germany
   
14.30-15.10  The role of simulation in high performance electronic design.
Alain Michel, Business Development Manager Electronics, Europe Ansys France
15.10-15.50  Microcircuits failures caused by electrochemical migration,
 Balint Medgyes, Ph.D., Electronic Technology Department, Budapest University of Technology, Hungary
15.50-16.30  Electronic Development in Household Appliances
 Alexander Neufeld,  Miele & Cie. KG | Werk Electronic, Germany
   
16.30-17.00     Networking Break
   
17.00-19.00 Second Session: Design for Manufacturing Session chairs:
Prof. Aurel-Ştefan GONTEAN, Ph.D., “Politehnica” University of Timişoara, Romania
Hartmut Hohaus
General Manager, Miele Tehnica SRL
   
17.00-17.40 Life time prediction of solder joints
Prof. Zsolt Illyefalvi-Vitez, Ph.D., Electronic Technology Department, Budapest University of Technology and Economics, Hungary
17.40-18.20 DFM Concept integrated in the predicted Life Cycle of a New Product
Ioan Plotog, Ph.D., Politehnica University of Bucharest, Romania
18.20-19.00 Corrosion induced by whisker growing
Balazs Illes, Ph.D., Electronic Technology Department, Budapest University of Technology and Economics, Hungary