Preliminary Programme Workshop TIE 2014

Posted by admin On March 20, 2014 ADD COMMENTS

WORKSHOP

 „ADVANCE TOPICS IN ELECTRONICS DESIGN AND ASSEMBLING TECHNOLOGY”

April 10, 2014

 

13.00–16.30  Registration
14.15-14.30  Welcome universities:
Prof. Marius Oteşteanu,Ph.D., Vice-rector for Scientific Research and External Relations, “Politehnica” University of Timişoara, Romania
Welcome industries: 
Prof. Dr. h. c. Christian von Albrichsfeld, Ph.D., Continental, Romania 
Welcome TIE technical workshop:
Prof. Dr. h. c.  Paul Svasta, Ph.D.  Politehnica University of Bucharest, Romania
14.30-16.30 First Session: Electronic Module Value ChainSession chairs:
Prof. Dan Pitică, Ph.D., Technical University of Cluj Napoca, Romania
Detlef Bonfert, Ph.D., Fraunhofer EMFT, Munich, Germany
   
14.30-15.10  The role of simulation in high performance electronic design.
Alain Michel, Business Development Manager Electronics, Europe Ansys France
15.10-15.50  Microcircuits failures caused by electrochemical migration,
 Balint Medgyes, Ph.D., Electronic Technology Department, Budapest University of Technology, Hungary
15.50-16.30  Electronic Development in Household Appliances
 Alexander Neufeld,  Miele & Cie. KG | Werk Electronic, Germany
   
16.30-17.00     Networking Break
   
17.00-19.00 Second Session: Design for Manufacturing Session chairs:
Prof. Aurel-Ştefan GONTEAN, Ph.D., “Politehnica” University of Timişoara, Romania
Hartmut Hohaus
General Manager, Miele Tehnica SRL
   
17.00-17.40 Life time prediction of solder joints
Prof. Zsolt Illyefalvi-Vitez, Ph.D., Electronic Technology Department, Budapest University of Technology and Economics, Hungary
17.40-18.20 DFM Concept integrated in the predicted Life Cycle of a New Product
Ioan Plotog, Ph.D., Politehnica University of Bucharest, Romania
18.20-19.00 Corrosion induced by whisker growing
Balazs Illes, Ph.D., Electronic Technology Department, Budapest University of Technology and Economics, Hungary

 

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