WORKSHOP
„ADVANCE TOPICS IN ELECTRONICS DESIGN AND ASSEMBLING TECHNOLOGY”
April 10, 2014
13.00–16.30 | Registration |
14.15-14.30 | Welcome universities: Prof. Marius Oteşteanu,Ph.D., Vice-rector for Scientific Research and External Relations, “Politehnica” University of Timişoara, Romania Welcome industries: Prof. Dr. h. c. Christian von Albrichsfeld, Ph.D., Continental, Romania Welcome TIE technical workshop: Prof. Dr. h. c. Paul Svasta, Ph.D. Politehnica University of Bucharest, Romania |
14.30-16.30 | First Session: Electronic Module Value ChainSession chairs: Prof. Dan Pitică, Ph.D., Technical University of Cluj Napoca, Romania Detlef Bonfert, Ph.D., Fraunhofer EMFT, Munich, Germany |
14.30-15.10 | The role of simulation in high performance electronic design. Alain Michel, Business Development Manager Electronics, Europe Ansys France |
15.10-15.50 | Microcircuits failures caused by electrochemical migration, Balint Medgyes, Ph.D., Electronic Technology Department, Budapest University of Technology, Hungary |
15.50-16.30 | Electronic Development in Household Appliances Alexander Neufeld, Miele & Cie. KG | Werk Electronic, Germany |
16.30-17.00 | Networking Break |
17.00-19.00 | Second Session: Design for Manufacturing Session chairs: Prof. Aurel-Ştefan GONTEAN, Ph.D., “Politehnica” University of Timişoara, Romania Hartmut Hohaus General Manager, Miele Tehnica SRL |
17.00-17.40 | Life time prediction of solder joints Prof. Zsolt Illyefalvi-Vitez, Ph.D., Electronic Technology Department, Budapest University of Technology and Economics, Hungary |
17.40-18.20 | DFM Concept integrated in the predicted Life Cycle of a New Product Ioan Plotog, Ph.D., Politehnica University of Bucharest, Romania |
18.20-19.00 | Corrosion induced by whisker growing Balazs Illes, Ph.D., Electronic Technology Department, Budapest University of Technology and Economics, Hungary |